Connecting Atomistic Level to Engineering Analysis in the Study of Debonding Mechanisms
Assist in research on the adhesion between epoxy and silica using molecular dynamics (MD) simulation, prepare meso-scale epoxy-silica specimens for mechanical testing, and provide support in data analysis and manuscript writing.
A good honours degree in Engineering/Civil Engineering/Computer Science/ Materials Science, with experience in simulation and using Linux platform. Good interpersonal skills with interest in mechanics and experimental work are required.
(For further information, please contact Dr. Denvid LAU at email "denvid.lau@cityu.edu.hk" or call 3442-6829.)
Salary offered will be highly competitive, commensurate with qualifications and experience. Fringe benefits include leave, medical and dental consultations at the campus clinic.
Additional information and application form (Application Form for Temporary/Part-time Posts) are obtainable :
Please quote the reference number in the application and submit via email at hrojob@cityu.edu.hk, fax at 2788 1154/3442 0311 or by post to the Human Resources Office. Applications will receive full consideration until the position is filled and only shortlisted applicants will be contacted. The University's privacy policy is available on the homepage.
City University of Hong Kong is an equal opportunity employer and we are committed to the principle of diversity. We encourage applications from all qualified candidates, especially those who will enhance the diversity of our staff.
City University of Hong Kong was ranked the 4th among the world’s top 50 universities under the age of 50 in the Quacquarelli Symonds 2014 survey.
